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| Datasheet File OCR Text: |
| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE9101-B Issued Date : 1996.03.27 Revised Date : 2000.05.01 Page No. : 1/2 H1N400X Series General Purpose Rectifiers Features * High Reliability * Low Cost * Low Leakage * Low forward voltage drop * High Current Capability * Glass Passivated Junction Maximum Ratings & Electrical Characteristics Ratings at 25C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load. Drate current by 20%. Ratings Maximum recurrent peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward recitified current .375"(9.5mm) lead length (Ta=75C) Peak forward surge current 8.3ms single half sine-wave superimposed on rated load Typical thermal resistance (Note2) Typical junction capacitance (Note1) Operating & storage temperature Tj Maximum instantaceous forward voltage at 1.0A DC Maximum DC reverse current at rated DC blocking voltage @Ta=25C @Ta=100C Maximum full load reverse current average full cycle .375"(9.5mm) lead at Tj=75C Note 1 : Measured at 1MHz and applied reverse voltage of 4.0 volts. Note 2 : Thermal resistance from junction to ambient 9.5mm lead length. Symbol VRRM VRMS VDC IO IFSM RJA CJ Tstg VF IR 4001 50 35 50 4002 100 70 100 1 30 50 30 4004 400 280 400 4007 1000 700 1000 Unit V V V A A C/W pF C V -50 to +175 1.1 5 50 30 uA uA HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. DO-41 Dimension Spec. No. : HE9101-B Issued Date : 1996.03.27 Revised Date : 2000.05.01 Page No. : 2/2 E A B C D DO-41 Molded Plastic Package HSMC Package Code : L *:Typical DIM A B C Inches Min. Max. 0.0280 0.0340 1.0000 0.1600 0.2050 Millimeters Min. Max. 0.71 0.86 25.40 4.10 5.20 DIM D E Inches Min. Max. 1.0000 0.0800 0.1070 Millimeters Min. Max. 25.40 2.00 2.70 Notes : 1.Dimension and tolerance based on our Spec. dated May 28,1998.a 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : * Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : * Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification |
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